Electronics Forum: high temp solder (Page 316 of 323)

Re: Solder Paste from 500 gram tubes.

Electronics Forum | Wed Jul 21 10:05:22 EDT 1999 | Mark Quealy

| | | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk p

Re: AQL values....how low can you go ?

Electronics Forum | Mon Oct 25 15:45:11 EDT 1999 | Dave F

Joe: Lemme see, you�re talking about controlling your manufacturing process within 4.6 defects per 100 opportunities or a 4,600 dpmo rate, a cumulative 99.95 acceptance rate, or a �2 sigma process, right? So, it�s fairly basic stuff, eh? First, yo

Re: Metal based PCB reflow.

Electronics Forum | Thu Jun 10 12:10:41 EDT 1999 | Earl Moon

| | | I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | | | There is anybody has experience on metal-based PCB reflow process?

Re: uBGA's

Electronics Forum | Tue May 18 16:22:43 EDT 1999 | Earl Moon

| | | Hi Guys, | | | | | | I am going to be graced with the good luck of processing microBGA's in the near future. A bit of a step forward from printing 20-mil pitch and wave soldering 0805's, wouldn't you say? | | | | | | So, any of you folks who

Re: Stencil Cleaning

Electronics Forum | Fri Mar 12 13:30:06 EST 1999 | Bill Schreiber

Dear Scott, You are correct in questioning the chemistry portion of the process. However, I am couriuous as to why you selected DEK as a stencil cleaner. The most important part of any cleaning process is always the chemistry. How you deliver the c

Re: Stencil Cleaning

Electronics Forum | Fri Mar 12 13:40:53 EST 1999 | Bill schreiber

In a nutshell, you should be looking for a chemistry first, then look for a machine. Hopefully, they will be from the same source. | Dear Scott, | You are correct in questioning the chemistry portion of the process. However, I am couriuous as to w

Re: Component Packaging Trends

Electronics Forum | Thu Oct 15 17:14:50 EDT 1998 | Justin Medernach

| Hi Folks, | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process?

Re: Who's Who's in Screen Printers for Contract Manufactuers

Electronics Forum | Sat Jun 13 00:33:41 EDT 1998 | Scott McKee

| Hidee Ho Brian! | Just like the other Steve, we just bought a SPM too. Our is brand new, and it's a SPM-AV (has vision). The other option we have is a automatic underside stencil cleaner. | We're a contract assembler as well, just starti

50 PPM

Electronics Forum | Wed Aug 21 12:57:41 EDT 2002 | dragonslayr

I would like to address several issues. First, your reflow is 150 PPM for the same exact assemblies that have lower PPM's? or are you giving a 150 PPM rating for all products produced through the reflow process in a specific time period? Reflow is a

speedline sale

Electronics Forum | Wed Nov 05 19:40:25 EST 2003 | Mike Konrad

Here's the official press release... New York, NY (November 5, 2003) -- KPS Special Situations Fund II announced today that it has acquired the stock and related assets of Speedline Technologies, Inc. from Cookson Group, plc for a total consideratio


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